A Green Alternative
Low Pressure Moulding is an innovative process designed to protect your electronics from environmental factors such as moisture, dust, vibration and handling.
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How can Low Pressure Moulding can improve my product?
Think of the '4R approach':
Rethink
The Low Pressure Moulding process allows designers and engineers greater flexibility when designing products when compared to housing electronics in enclosures.
Low Pressure Moulding allows the encapsulation to be the enclosure meaning graphics and surface treatments can be moulded directly onto the surface of the part.
With Low Pressure Moulding, there is no need to compromise.
A Simple Solution for Safe Protection
When you replace traditional electronics potting with the Low Pressure Moulding Process you are replacing up to 8 steps with 3 simple steps.
STEP 1
Insert electronics
Insert parts directly into the mouldset.
STEP 2
Mould
30 sec – 2 min encapsulation process.
STEP 3
Test device
Parts handled immediately after moulding.
Equipment Matters
Tarapath offer both Optimel and LPMS low pressure moulding equipment, along with other peripheral requirements such as chillers, dryers and auto-feed systems.
Material Selection
Choose the right Henkel TECHNOMELT material for your application
Product examples
Low Pressure Moulded products extend across a variety of applications catering for a diverse array of industry sectors.
Temperature Sensor
Cable Moulding
Overmoulded PCB
Electronics Encapsulation
Junction Ground Plate
Cable Moulding
Strain Relief
Cable Moulding
Question?
Let us assess your product and see if Low Pressure Moulding is the solution you’ve been looking for.